# TSMC Open Innovation Platform expansion

> Live situation record from CLSTR: https://clstr.news/situations/tsmc-open-innovation-platform-expansion
> Updated: 2026-09-28T06:11:39.000Z. Sources: 14. Developments: 3.

TSMC is expanding its Open Innovation Platform (OIP) through various strategic partnerships aimed at advancing semiconductor design and production efficiency.

Initially, GS Microelectronics joined the OIP Value Chain Alliance as a North American member partner to accelerate silicon design innovation. Subsequently, the platform expanded via imec IC-Link, which joined the OIP Cloud Alliance to offer cloud-managed chip design services, providing secure access to advanced process nodes for AI, automotive, and industrial applications. Additionally, IP provider M31 and Ambiq partnered to launch a Foundation IP solution based on the TSMC N12e process for AIoT and wearable devices.

Recent developments include an enhanced partnership with Siemens Digital Industries Software to integrate AI-driven automation into semiconductor design. This collaboration focuses on improving productivity through an AI-powered agent for automated design rule check (DRC) fixing, utilizing Siemens’ Calibre, Aprisa, and Solido software to navigate the complexities of advanced process nodes. 

Furthermore, imec IC-Link has solidified its role within the OIP Cloud Alliance as the first managed-cloud service supporting mixed-partner EDA flows. This service provides customers with secure, cloud-based access to advanced TSMC process design kits (PDKs) and scalable computing resources, aiming to help innovators in the AI, automotive, and communications sectors accelerate development by reducing the need for complex local design infrastructures.

## Timeline

### 2026-09-28: TSMC expands semiconductor design ecosystem via AI and cloud partnerships

TSMC is expanding its Open Innovation Platform through AI-driven design automation with Siemens and new cloud-based design services via IC-Link by imec to simplify advanced semiconductor development.

5 sources. https://clstr.news/cluster/tsmc-expands-semiconductor-design-ecosystem-via-ai-and-cloud-partnerships

### 2026-09-24: TSMC expands Open Innovation Platform via imec IC-Link and M31 partnerships

TSMC is strengthening its Open Innovation Platform through imec IC-Link’s cloud-managed design services and a new low-power Foundation IP solution from M31 and Ambiq for edge AI applications.

2 sources. https://clstr.news/cluster/tsmc-expands-open-innovation-platform-via-imec-ic-link-and-m31-partnerships

### 2026-09-14: GS Microelectronics joins TSMC Open Innovation Platform Alliance

GS Microelectronics U.S., Inc. has joined TSMC’s Open Innovation Platform Value Chain Alliance in North America to provide integrated ASIC services and streamlined silicon design production.

6 sources. https://clstr.news/cluster/gs-microelectronics-joins-tsmc-open-innovation-platform-alliance

---
Cite as: TSMC Open Innovation Platform expansion. CLSTR, https://clstr.news/situations/tsmc-open-innovation-platform-expansion