Advanced semiconductor packaging demand surges amid supply chain expansion

The advanced semiconductor packaging industry is experiencing rapid growth driven by surging demand, though manufacturers face significant bottlenecks. ASE Technology Holding reported that demand for advanced packaging is expanding quickly, with some companies seeing growth of several hundred percent compared to last year.

Key challenges identified include limited factory space and long equipment lead times. To address these, the 3DIC manufacturing alliance is working to integrate the ecosystem, including system integrators and academic partners like National Taiwan University, to improve software capabilities and standardization.

In response to the 'Taiwan Plus One' strategy, JADE Technics is expanding its global footprint. The company is preparing manufacturing capabilities in the United States, focusing initially on aerospace and defense applications, while its new facility in Japan is expected to begin mass production between late 2027 and 2028. TSMC is also emphasizing the need for 'parallel development' and Silicon-Technology Co-Optimization (STCO) to maintain the rapid pace of annual technical upgrades.