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AI boom drives surge in HBM and silicon wafer prices
The artificial intelligence boom is driving significant price increases across the semiconductor supply chain. According to TrendForce, High Bandwidth Memory (HBM) blended average selling prices (ASP) are projected to rise by 121% in 2027 due to sustained demand for AI servers and limited supply of advanced processes.
To manage rising system costs and supply constraints, GPU and ASIC manufacturers are considering shifting toward 8-Hi HBM configurations rather than 12-Hi. However, this shift may not lower costs per unit of capacity; 8-Hi products are expected to be 10-20% more expensive per Gb than 12-Hi products in 2027 because the base die costs are spread over fewer DRAM dies.
Beyond memory, the demand for AI hardware is impacting raw materials. Prices for 300mm silicon wafers could increase by 10% to over 40% in 2027. Additionally, CoWoS packaging capacity is projected to grow by 70.9% year-over-year in 2027, while deliveries of AI-specific GPUs and ASICs are expected to rise by 44.9%.
In the broader consumer market, memory manufacturers like Samsung, SK Hynix, and Micron have increasingly prioritized long-term agreements for AI-related capacity. This shift has contributed to rising prices for consumer-grade components, including SSDs and DDR4/DDR5 RAM kits.
Entities
AMD · Intel · Micron · Nvidia · SK Hynix · SUMCO · Samsung · TrendForce
Claims
What the coverage asserts, and how many sources carry each claim.
- [● 3 SOURCES] HBM 8-Hi products may be 10-20% more expensive per Gb than 12-Hi products in 2027. technews.tw · crn.pl · itreseller.pl
- [○ 1 SOURCE] 300mm silicon wafer prices could rise by 10% to over 40% in 2027. itreseller.pl
- [● 2 SOURCES] TrendForce predicts HBM blended ASP will increase by 121% in 2027. technews.tw · crn.pl
- [○ 1 SOURCE] CoWoS packaging capacity is projected to increase by 70.9% year-over-year in 2027. itreseller.pl
- [○ 1 SOURCE] AI GPU and ASIC deliveries are expected to increase by 44.9%. itreseller.pl