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AMD launches Helios rack‑scale AI platform and new EPYC processors
AMD announced a suite of new AI‑focused products at its Advancing AI conference. The flagship Helios rack‑scale system combines Instinct MI455X GPUs, 6th‑gen EPYC "Venice" CPUs, Pensando networking and the ROCm software stack, targeting gigawatt‑scale AI data‑centers. Production of the second‑generation Helios is now in full‑scale manufacturing with first shipments expected within months. AMD also unveiled its Zen 6‑based EPYC 9006 series, offering up to 256 cores, 1 GB of L3 cache and PCIe 6.0 support for edge and data‑center workloads. The company disclosed partnerships to accelerate adoption: a reference design with Schneider Electric for power, cooling and infrastructure planning; a memory supply agreement with Samsung for HBM4 chips; and a strategic AI infrastructure deal with Anthropic that will deploy up to 2 GW of Instinct MI450 GPUs in Helios racks, alongside a planned up‑to‑$5 billion equity investment. AMD projects the AI accelerator market to reach $1.4 trillion and the broader AI‑related market to $2 trillion by 2030, positioning Helios as a direct competitor to Nvidia’s Vera Rubin and Grace Blackwell platforms.