AMD may utilize Intel advanced-packaging technology

AMD may become a customer of Intel Foundry’s EMIB-T advanced-packaging technology, according to analysis from UBS. The report suggests AMD, alongside Google, Apple, and SpaceX, could utilize Intel’s packaging capacity to alleviate pressure on TSMC’s capacity, which is currently strained by high demand for AI accelerators from NVIDIA and other hyperscalers.

EMIB-T technology uses silicon bridges with through-silicon vias to enable high-density die-to-die signaling and power delivery. While Intel has reportedly achieved a 90% verification yield for EMIB-T, substrate yields are currently around 50%. Commercial mass production is targeted for 2027.

Using Intel for packaging would not necessarily mean AMD moves its wafer fabrication away from TSMC; instead, it would reflect an industry trend of separating fabrication, interconnect, and final assembly. For AMD, securing a second source for packaging could reduce dependency on a single supplier and support larger shipments of AI accelerators. This comes as AMD faces significant competition in the data center rack market, with projections suggesting NVIDIA will maintain a substantial lead in rack shipments through 2028.