Amkor Technology increases Arizona investment to $12 billion

Amkor Technology has announced the second phase of its semiconductor packaging and testing campus expansion in Arizona, increasing the total planned investment to approximately $12 billion. The expansion is driven by customer demand that has already exceeded the cleanroom capacity originally planned for the first phase.

Phase 2 is expected to add 60,000 square meters of cleanroom space, bringing the total campus capacity to roughly 93,000 square meters. Construction for this second stage is scheduled to begin in late 2027, with completion targeted for the end of 2029. Once fully operational, the campus is expected to employ more than 3,500 people in Arizona.

The facility will provide wafer bumping, probe, assembly, and testing capabilities. Amkor noted that this site will serve as the first high-volume outsourced semiconductor assembly and test (OSAT) production facility in the United States dedicated to advanced packaging.