Asahara Giken to demonstrate compact 3D sensing system at CEATEC 2026

Asahara Giken has announced it will demonstrate a new, compact 3D sensing system at CEATEC 2026, held at Makuhari Messe from October 13 to 16. The system utilizes a Laser Scanning Projector (LSP) module from QD Laser as its light source, integrated with cameras and proprietary measurement software developed by Asahara Giken.

The technology incorporates MEMS scan engine components from Taiwan-based Ultimems. The resulting module is highly compact, weighing approximately 35g and connecting via USB Type-C. Because it uses a laser scanning method, the system is focus-free and maintains image clarity even when projected from an angle.

The demonstration will showcase the system's ability to switch between three measurement methods: phase shift, moiré, and light sectioning. Asahara Giken intends to target applications in robotic end-effectors, automated inspection equipment, and dimension measurement. The company aims to enhance its ‘2D + 3D + AI’ inspection framework, combining shape measurement with AI-driven visual analysis to improve accuracy in industrial environments.