ASE Technology Holding revenue rises 45% on AI chip demand

ASE Technology Holding (日月光投控) reported a significant increase in revenue for September 2026, reaching 88.13 billion TWD. This represents a 45.52% increase year-on-year and a 7.15% increase month-on-month, driven by sustained demand for AI chips and high-performance computing (HPC).

To meet the growing demand for advanced packaging, the company has increased its annual capital expenditure forecast to approximately 10.5 billion USD. ASE is actively expanding its production capacity, including the construction of advanced packaging facilities in Taiwan and the development of new plants in the Renwu Industrial Park, Kaohsiung.

The company's revenue structure remains dominated by semiconductor packaging, which accounts for 52% of its business, followed by electronic manufacturing services at 34% and testing services at 13%. ASE continues to focus on heterogeneous integration, 3D IC, and its VIPack advanced packaging platform to support high-end semiconductor requirements.