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ASML secures semiconductor dominance through High-NA EUV adoption
ASML is solidifying its dominance in the semiconductor lithography market as major chipmakers accelerate the adoption of next-generation High-NA EUV technology. Driven by the artificial intelligence boom, demand for advanced chip-making equipment is surging. ASML's existing EUV machines are nearly fully booked through 2027.
Leading semiconductor manufacturers have established timelines for integrating High-NA EUV tools, which cost approximately $400 million each. Intel has emerged as an early adopter, reporting that it has already processed over one million wafers using this technology in its 1.8nm process. Samsung aims to implement High-NA for advanced DRAM production by 2028, while TSMC has committed to using the technology for mass production of advanced nodes starting in 2030.
To support this transition, ASML is collaborating with industry leaders to develop new standards, including the shift from 6-inch to 12-inch photomasks. This collective movement by non-Chinese semiconductor giants creates a significant technological barrier as competitors in other regions attempt to catch up using older DUV technologies.
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Claims
What the coverage asserts, and how many sources carry each claim.
- [● 3 SOURCES] SK Hynix has already introduced High-NA EUV equipment. blockchainseoul.kr · technews.tw · www.businesstimes.com.sg
- [● 4 SOURCES] ASML's existing EUV machines are nearly sold out through 2027. blockchainseoul.kr · technews.tw · www.businesstimes.com.sg · www.cash.ch
- [● 3 SOURCES] ASML holds approximately 94% of the global lithography market share as of 2025. blockchainseoul.kr · technews.tw · www.businesstimes.com.sg
- [● 3 SOURCES] High-NA EUV machines cost approximately $400 million each. blockchainseoul.kr · www.businesstimes.com.sg · www.cash.ch
- [● 3 SOURCES] Major chipmakers are collaborating with ASML to develop 12-inch photomasks for High-NA EUV. blockchainseoul.kr · technews.tw · biz.heraldcorp.com
- [● 5 SOURCES] TSMC intends to use High-NA technology for mass production of advanced nodes starting in 2030. blockchainseoul.kr · technews.tw · www.businesstimes.com.sg · biz.heraldcorp.com · www.cash.ch
- [● 4 SOURCES] Samsung plans to adopt High-NA EUV for advanced DRAM production by 2028. blockchainseoul.kr · technews.tw · biz.heraldcorp.com · www.cash.ch
- [● 4 SOURCES] Intel has already processed over 1 million wafers using High-NA EUV equipment. technews.tw · biz.heraldcorp.com · diit.cz · www.cnews.cz