C-TOUCH & DISPLAY 2026 opens in Shenzhen

The C-TOUCH & DISPLAY SHENZHEN 2026 exhibition opened on the 27th in Shenzhen, China, focusing on the integration of next-generation displays, semiconductor packaging, and optical materials. Organized by RX, the event highlights technologies such as OLED, Micro LED, and AI-driven augmented reality (AR) smart glasses.

A major highlight of the exhibition is the advancement in glass substrate technology for AI semiconductor packaging. Lens Technology showcased glass substrate samples utilizing Through-Glass Via (TGV) technology, claiming a hole defect rate of 0 PPM. This process involves high-aspect-ratio processing and diameters exceeding 20 micrometers, aiming for high yield and stability in advanced packaging.

Various Chinese equipment manufacturers are also participating, leveraging existing display panel manufacturing expertise to enter the glass substrate market. Companies such as NAURA, ACM Research, and Kernalman Technology are presenting specialized equipment, including PVD tools for large-area panels, packaging plating and etching systems, and laminators for film attachment. The event aims to foster supply chain cooperation between global enterprises and Chinese manufacturers.