Ceva and Actions Technology launch Bluetooth HDT wireless audio chips

Ceva Inc. and Actions Technology Co. Ltd. have introduced the ATS296X-series Bluetooth audio System‑on‑Chips, among the first commercial products to implement Bluetooth High Data Throughput (HDT). The HDT feature, slated for the upcoming Bluetooth 7.0 standard, raises peak data rates from 2 Mbps to about 7.5 Mbps, enabling lossless multi‑channel sound, ultra‑low‑latency gaming audio, faster file transfers and rapid over‑the‑air firmware updates. The chips target premium wireless audio devices such as Bluetooth speakers, wireless microphones and multichannel home‑audio systems, including soundbars with satellite speakers and subwoofers. The ATS296X series also incorporates Actions Technology’s proprietary dual‑radio‑frequency architecture, allowing concurrent operation across multiple scenarios.

The collaboration builds on a long‑standing partnership: Actions Technology has previously integrated Ceva’s audio DSP IP and shipped more than 100 million wireless audio SoCs using Ceva’s connectivity and sensing technologies. “Bluetooth HDT represents the next major evolution of wireless audio, enabling experiences that simply were not possible with previous Bluetooth generations,” said Tal Shalev, vice‑president and general manager of Ceva’s Wireless IoT Business Unit. Jeffers Gong, general manager of the Portable Audio Business Unit at Actions Technology, added that the joint effort provides manufacturers with an upgrade path to HDT while reducing development complexity and time‑to‑market.