Chillventa trade fair to showcase HVAC and refrigeration innovations

The Chillventa trade fair in Nuremberg is set to showcase advancements in the refrigeration, air conditioning, ventilation, and heat pump industries. A key participant, Armstrong Fluid Technology, will present a wide range of heating and cooling solutions, including intelligent pump technology, digital tools, and preconfigured technical centers. Their focus includes the Design Envelope technology, which aims to improve system performance and energy efficiency by allowing components to react to changing system requirements.

In addition to product exhibitions, the Chillventa Congress will provide scientific expertise through over 200 presentations. Key themes for the 2026 event include heat pumps, refrigerants within the context of sustainability and circular economy, and the utilization of cooling and waste heat in data centers. The event also features the 9th Innovation Day for Refrigeration Technology, highlighting research from German universities and colleges.