China tech innovation bond underwriting reaches 500.78 billion yuan in H1 2026

In the first half of 2026, Chinese securities firms acted as lead underwriters for 553 technology innovation bonds, totaling 500.78 billion yuan, according to statistics from the China Securities Association. The data also highlighted significant activity in other sectors, including 125.40 billion yuan in green bonds and 321.49 billion yuan in private enterprise bonds.

In Jiangsu Province, a recent promotion meeting in Nanjing resulted in the signing of 17 industrial sub-funds with a total scale exceeding 18.5 billion yuan. These funds, organized under the Jiangsu Strategic Emerging Industry Mother Fund, target sectors such as next-generation information technology, biomedicine, high-end equipment, new energy, and new materials.

The Jiangsu province fund cluster has reached a cumulative scale of 298.2 billion yuan, having invested 10.43 billion yuan across 398 projects. New operational guidelines have been released to encourage more diverse participation from market-oriented private management institutions and central state-owned enterprises.