CXMT expands DRAM production capacity to meet AI demand

ChangXin Memory Technologies (CXMT) is significantly expanding its DRAM production capacity to address a global memory shortage driven by the rapid growth of artificial intelligence infrastructure. According to industry reports, CXMT aims to increase its monthly DRAM wafer production from approximately 320,000 to 600,000 by 2028. This expansion includes new manufacturing facilities planned for Beijing, Shanghai, and Hefei.

The global DRAM market is experiencing a supply crunch that analysts expect could persist through 2027. This shortage is largely attributed to the high demand for high-bandwidth memory (HBM) and advanced DRAM required for AI data centers. As major manufacturers prioritize high-value AI components, the supply of conventional DRAM for consumer electronics is facing increased pressure.

Despite recent volatility in chip stocks, CXMT has seen its global DRAM market share rise to over 10%, making it a significant competitor to established players like Samsung, SK Hynix, and Micron. The company recently projected a return to profitability for the first nine months of 2026, citing accelerating demand for AI computing power.