Intel Expands Sovereign Foundry Operations and Advanced Packaging Business

Intel’s stock has surged over 280% year‑to‑date as the company pivots from traditional PC processors to a government‑backed sovereign foundry model. Recent U.S. government investment and a partnership with Apple to use Intel’s foundry capabilities have bolstered confidence in the turnaround.

In June 2026 Intel created a dedicated advanced‑packaging division, appointing former SK Hynix CEO Seok‑Hee Lee as executive vice‑president. The unit focuses on high‑bandwidth memory integration and technologies such as Embedded Multi‑die Interconnect Bridge‑T and high‑density hybrid bonding, aiming to capture 10‑15% of the AI hardware packaging market. Analysts at Mizuho and Bank of America have raised price targets, reflecting expectations that Intel’s back‑end packaging could become a key growth driver alongside its foundry ambitions.