E&R Engineering Corp. to showcase advanced semiconductor processing at SEMICON Taiwan 2026

E&R Engineering Corp. (stock code: 8027) has announced it will showcase advanced semiconductor processing technologies at SEMICON Taiwan 2026. The company plans to present solutions for high-precision laser drilling and advanced composite plasma processes, specifically targeting Co-Packaged Optics (CPO) and advanced packaging requirements.

Key technologies to be featured include the FAU high-precision laser drilling solution, which utilizes five-axis laser control to achieve a drilling accuracy of ±0.5 μm. This is designed to meet the high-density optical component needs of high-speed communications. Additionally, the company will demonstrate its integration of Glass Core and Glass Carrier processes, including Through Glass Via (TGV) technology, to support the industry shift toward glass substrates driven by AI and High-Performance Computing (HPC).

The exhibition will highlight two core systems: the PHB-600A high-precision laser equipment, developed for large-scale glass plates, and the R-300R Hybrid Plasma System. The R-300R features a Hybrid MW–RF Plasma System that allows for independent control of MW and RF parameters, supporting diverse processes such as low-damage surface activation, cleaning, and deep silicon etching.