E&R Engineering to open new semiconductor plant in Malaysia

E&R Engineering Corp. has announced that its Malaysian subsidiary, E&R Semiconductor (Malaysia) Sdn. Bhd., will hold a grand opening ceremony for its new facility in the Melaka Free Trade Zone on October 13, 2026.

The expansion is a strategic move to meet rising demand from Southeast Asian customers and to upgrade the company’s global semiconductor packaging materials business. While operations continue to grow in China, the company is shifting part of its production focus to Malaysia to increase capacity. The new plant will produce high-end embossed carrier tape and cover tape, technologies essential for chip miniaturization and Chiplet trends.

The facility is currently undergoing sampling and testing, with mass production expected to begin in early 2027. The move is expected to create 50 local jobs and serve as a regional hub for field service engineers to provide immediate technical support to semiconductor and testing customers.