ESMC celebrates topping-out of new Dresden microchip factory

The European Semiconductor Manufacturing Company (ESMC) has celebrated a topping-out ceremony for its new microchip factory in northern Dresden, marking a significant milestone for the project. The facility represents the first European production site for the Taiwanese industry giant TSMC.

The project is a joint venture involving TSMC, which holds a 70 percent stake, alongside Bosch, Infineon, and NXP Semiconductor, each holding 10 percent. The total investment is valued at ten billion euros, with five billion euros provided in subsidies by the German Federal Ministry for Economic Affairs. The factory is expected to focus on producing up to 12-nanometer chips, primarily for the automotive industry.

Construction is progressing on schedule, with approximately 2,000 employees having assembled around 30,000 precast concrete elements. Production equipment is slated to arrive in the cleanrooms during the second half of 2027. To prepare for operations, training for future specialists has already commenced at TSMC's headquarters in Taiwan, focusing on integrating Taiwanese corporate culture with German engineering expertise.