Fujifilm triples semiconductor material production capacity in Oita

Fujifilm has announced the completion of a new building at its Fujifilm Electronic Materials Oita Plant, dedicated to the production of post-CMP (Chemical Mechanical Polishing) cleaners. The facility began operations in August 2026.

This expansion is designed to significantly increase production capacity for post-CMP cleaners by three times. These materials are essential in the semiconductor polishing process, used to clean metal surfaces and remove particles or organic residues while protecting the surface. The investment aims to meet the surging demand for advanced semiconductor materials driven by the growth of AI semiconductors and data centers.

The new facility features automated production equipment and quality evaluation tools capable of handling the extreme purity levels required for cutting-edge semiconductor manufacturing. Additionally, the building is equipped with solar panels to help reduce greenhouse gas emissions by utilizing renewable energy.