GS Microelectronics joins TSMC Open Innovation Platform Alliance

GS Microelectronics U.S., Inc. (GSME) has joined TSMC’s Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a member partner in North America. The partnership aims to accelerate silicon design innovation by providing a seamless transition from prototype to high-volume production.

GSME intends to leverage the collaboration to deliver comprehensive ASIC services across the integrated circuit value chain, including IP development, front-end architecture, back-end physical design, wafer manufacturing, advanced packaging, assembly, and testing. The company seeks to offer customers a lower-risk path through end-to-end visibility, reducing the costs and delays typically associated with using multiple vendors.

Founded in 2022 and backed by Series B funding from Maverick Silicon, GSME has expanded from a Silicon Valley startup into a global operation with locations in San Jose, Phoenix, Hsinchu, Ho Chi Minh City, Danang, and Muscat.