Hanmi Semiconductor MSVP equipment sales expected to double this year

Hanmi Semiconductor announced that sales of its Micro Saw & Vision Placement (MSVP) equipment are expected to exceed 200 units this year, more than doubling previous year levels. The company reported that cumulative MSVP revenue from January to August has already surpassed its total annual revenue for 2025.

The MSVP is a semiconductor back-end process equipment that combines a precision cutting micro saw with vision placement for cleaning, drying, inspecting, and stacking. It is utilized in the production of DRAM, NAND flash, High Bandwidth Memory (HBM), and system semiconductors, as well as PCB and glass substrates.

Having successfully localized the micro saw technology in 2021 to reduce reliance on Japanese suppliers, Hanmi Semiconductor has secured significant international orders. This includes a recent contract worth approximately 7.87 billion won with the Thailand subsidiary of UTAC, a semiconductor OSAT provider. The company plans to expand its global presence by establishing a US entity, Hanmi USA, in October to meet increasing demand from AI data centers and high-performance computing markets.