HELB opens 2026/2027 student loan applications via USSD

The Higher Education Loans Board (HELB) has announced that the application process for 2026/2027 subsequent loans is currently open for continuing university and college students in Kenya.

To facilitate accessibility, the board has introduced a USSD-based application method that does not require a smartphone or an internet connection. Students can access the service by dialing *642# on a Safaricom mobile line. The process involves registering with a National Identification serial number and ID number, creating a four-digit PIN, and selecting the appropriate loan category for either undergraduate degree programmes or TVET diploma qualifications.