Honor upcoming smartphone leaks reveal high-end specs

Leaks regarding Honor's upcoming smartphone lineup suggest significant hardware advancements for the Magic 9 and 700 series.

The Honor Magic 9, expected to launch in Beijing on September 28, is rumored to feature the Snapdragon 8 Elite Gen 6 processor manufactured by TSMC using a 2-nanometer process. To manage heat from high-performance tasks and on-device AI, the device may include an integrated active cooling fan. For photography, Honor is reportedly collaborating with Arri to implement a 200-megapixel main sensor with optical image stabilization (OIS).

Additionally, reports concerning the Honor 700 Pro suggest the inclusion of a 1.72-inch secondary display on the rear of the device. This model is expected to feature a 6.57-inch 1.5K main display with slim, symmetrical bezels and a 200-megapixel primary camera, positioning it as a more compact flagship option.