Huada Beidou unveils chip-level solutions for high-precision Beidou applications

At the 5th Beidou Scale Application International Summit held in Zhuzhou, Huada Beidou presented a comprehensive matrix of chip-level solutions designed to integrate high-precision Beidou positioning technology into various consumer and industrial sectors.

The company showcased specialized solutions for several key areas:

• Intelligent Driving: Collaborating with major manufacturers like SAIC Motor, Huada Beidou provides automotive-grade high-precision chips that support seamless positioning in complex environments like tunnels and urban canyons. • Transportation Safety: Implementing dual-frequency high-precision chips combined with inertial navigation to ensure continuous tracking for commercial vehicles in signal-blocked areas. • Electric Two-Wheelers: Providing low-power, high-integration chips to meet new national standards requiring Beidou modules in electric bicycles by September 2025. The company has partnered with Yadea on this initiative. • Shared Mobility: Offering high-performance SoC designs for shared bicycles to enable precise electronic fencing and parking management. As of 2025, the company's shared bike chips have exceeded 15 million units in sales, capturing over 60% of the domestic market.

These developments aim to transition Beidou technology from industrial applications into mass-market consumer products, including smart wearables.