Huawei expands LogicFolding chip technology to more smartphones

Huawei has announced the expansion of its LogicFolding chip technology to more smartphone models as part of a strategy to strengthen its global market position. Richard Yu, Chairman of Huawei Consumer Business Group, confirmed that the company intends to utilize these chips in future devices, following their introduction in the Mate XT 2 featuring the Kirin 9050 Pro.

This new architecture, developed under the Tau scaling law, utilizes a vertical stacking method for circuits. By replacing long horizontal wiring with shorter vertical connections, the technology aims to reduce signal latency and improve energy efficiency.

In addition to the chip expansion, Huawei reported a significant milestone, having shipped over 100 million devices equipped with Kirin processors since its return to the high-end smartphone market in 2023. Despite facing challenges such as rising component costs and semiconductor supply chain constraints due to international export restrictions, the company has officially moved into mass production for the Kirin 9050 series.