Huawei launches Mate 90 series with Kirin 9050 Pro chip

Huawei has officially launched its Mate 90 flagship smartphone series in China, featuring several models including the Mate 90, Pro, Pro Max, and the exclusive RS Ultimate Design. The series introduces significant hardware advancements, most notably the Kirin 9050 Pro chipset.

Technical teardowns and benchmarks reveal that the Kirin 9050 Pro utilizes a sophisticated 3D stacked design, employing a LogicFolding technique with copper-to-copper hybrid bonding. This architecture uses two stacked dies connected by approximately 80,000 through-silicon vias (TSVs) to reduce latency and improve performance. Early Geekbench 7 results for the Mate 90 Pro Max indicate a nine-core CPU architecture, with performance levels positioned between the Snapdragon 8 Gen 1 and Gen 2.

Other notable features of the Mate 90 series include displays capable of reaching 12,000 nits of peak brightness, Kunlun Glass protection, and the XMAGE camera system. Huawei emphasized that these developments are the result of massive long-term R&D investments aimed at achieving greater vertical integration of hardware, software, and chips.