Semiconductor market projected to exceed $1.6 trillion by 2026

semiconductor market AI infrastructure Ascend 960 advanced manufacturing memory chips

The global semiconductor market is projected to exceed $1.6 trillion by 2026, driven by massive investments in artificial intelligence infrastructure. Analysts suggest that memory chip manufacturers, specifically Samsung Electronics and SK hynix, are expected to control more than half of this market as AI data processing demands surge.

In the hardware sector, Huawei has announced that its Ascend 960 AI chip development is ahead of schedule. The company expects the Ascend 960 DT to be ready in Q1 2027 and the Ascend 960 PR in Q3 2027, with the new series promising to double the performance of previous models. Huawei is also introducing the Ascend 960 super node, which utilizes Near-Package Optics (NPO) technology to enhance connectivity and efficiency.

Regarding manufacturing challenges, TSMC Co-COO Jerry Mi noted that while AI is highly effective for programming and chip design tasks with fixed inputs, it faces significant limitations in developing next-generation semiconductor processes like 1.4nm (A14). He described current AI capabilities as a '3-year-old superman'—possessing immense power but lacking the understanding to navigate the unknown variables and physical constraints inherent in pioneering new manufacturing technologies.

Entities

Ascend 960 · Hi-ONE · Huawei · Jerry Mi · SK Hynix · Samsung Electronics · TSMC · Wang Tao · Xu Zhijun

Claims

What the coverage asserts, and how many sources carry each claim.

[● 2 SOURCES] AI faces limitations in developing next-generation semiconductor processes due to a lack of historical data www.technice.com.tw
[● 2 SOURCES] Huawei is developing the Ascend 960 super node using NPO technology www.chinesepress.com
[● 4 SOURCES] Samsung and SK hynix memory chips are expected to account for over half of the global semiconductor market bhaskarlive.in · www.socialnews.xyz · samacharnama.com · www.bhaskarhindi.com
[○ 1 SOURCE] Huawei's Ascend 960 PR is expected to be ready in Q3 2027 www.chinesepress.com
[● 2 SOURCES] TSMC Co-COO Jerry Mi is describing AI as a '3-year-old superman' www.technice.com.tw
[● 2 SOURCES] The Ascend 960 chip will double the performance of its predecessor www.chinesepress.com · www.transmedia.cl
[○ 1 SOURCE] Huawei's Ascend 960 DT is expected to be ready in Q1 2027 www.chinesepress.com
[● 4 SOURCES] The global semiconductor market is projected to exceed $1.6 trillion in 2026 bhaskarlive.in · www.socialnews.xyz · samacharnama.com · www.bhaskarhindi.com