Hyundai Mobis accelerates domestic automotive semiconductor development

Hyundai Mobis is expanding its collaborative ecosystem to cover the entire lifecycle of automotive semiconductor production, from design to mass production. During the second ‘Auto Semicon Korea’ (ASK) forum, the company announced that it has commenced the development of 13 types of system semiconductors through collaborations with domestic partners. Notably, nine of these types have already had specific vehicle models designated for their application.

The initiative aims to stabilize the supply chain and reduce reliance on foreign semiconductors, a necessity highlighted by recent global shortages. Hyundai Mobis plans to begin integrating these developed components into the early testing stages of vehicle parts starting next year, with a target for first application in mass-produced Hyundai and Kia vehicles by 2029.

To support this transition, a ‘Vehicle Semiconductor One Team TF’ has been launched, involving the Ministry of Trade, Industry and Energy, Hyundai Motor, Hyundai Mobis, and LG Electronics. Additionally, the Cheonan Vehicle Semiconductor Support Center is expected to be operational by 2027 to provide reliability verification and testing infrastructure.