IC bonder market projected to reach 2.887 billion USD by 2032

LP Information Co., Ltd. has released a growth forecast for the global IC bonder market spanning 2026 to 2032. The market is projected to grow from approximately 1.772 billion USD in 2025 to roughly 2.887 billion USD by 2032, representing a compound annual growth rate (CAGR) of approximately 6.79%.

Growth is primarily driven by advancements in advanced packaging technologies, including chiplets, High Bandwidth Memory (HBM), 2.5D/3D integration, and hybrid bonding. These technologies are shifting equipment requirements toward higher precision alignment, stable load and temperature control, and intelligent process monitoring.

The Asia-Pacific region remains the largest market for production and demand due to established supply chains in foundries, memory, and electronic manufacturing. Other key regions include North America, focused on AI and High-Performance Computing (HPC), and Europe, driven by automotive electronics and power semiconductors.