IIT Madras unveils advanced flat‑plate pulsating heat pipe for compact electronics

Researchers at the Indian Institute of Technology Madras have designed and experimentally validated a new flat‑plate pulsating heat pipe (FPPHP) that improves thermal management in compact electronic devices. Led by Prof. Arvind Pattamatta and Dr. Pallab Sinha Mahapatra, the team introduced an antiparallel arrangement that places the evaporator and condenser on opposite faces of the plate, making it suitable for tightly‑spaced housings.

Two sealing options were tested: a conventional silicone gasket and an O‑ring configuration. The O‑ring design achieved about 16% lower overall thermal resistance at higher heat loads, with a measured resistance of 0.44 K/W at a 100 W input and an evaporator temperature near 69 °C. Using aluminium instead of copper further reduced resistance by roughly 20% while cutting weight. The passive device operates without external power, circulating fluid by natural evaporation and condensation, and is proposed for use in consumer electronics, data‑centre servers, defence platforms and electric vehicles. "Think of it like a small, sealed tube that contains a liquid which sloshes back and forth," Pattamatta explained.