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Infineon and Eaton partner on SiC technology for AI data centers
Infineon Technologies and Eaton have announced a collaboration to supply silicon carbide (SiC) power devices for Eaton’s MVSST 2.0 medium-voltage solid-state transformer platform. The technology is specifically designed to support 800V DC power architectures, aiming to improve the efficiency and reliability of power conversion for AI data centers.
As AI workloads drive higher power demands, the partnership seeks to optimize the transition of electricity from the medium-voltage grid to high-density computing infrastructure. The MVSST 2.0 platform is intended for initial deployment in the Asia-Pacific region and is noted as one of the first medium-voltage solid-state transformer platforms to receive IEC certification. By reducing the number of power conversion stages required compared to conventional architectures, the solution aims to increase power density and deployment flexibility for large-scale AI clusters.
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- [● 2 SOURCES] Infineon is supplying silicon carbide power devices to Eaton. www.it-boltwise.de · www.eenewseurope.com
- [● 2 SOURCES] Eaton will use Infineon’s silicon carbide devices in its MVSST 2.0 medium-voltage solid-state transformer platform. www.it-boltwise.de · www.eenewseurope.com
- [○ 1 SOURCE] The MVSST 2.0 platform is intended for initial deployment across the Asia-Pacific region. www.eenewseurope.com
- [● 2 SOURCES] The MVSST 2.0 platform targets 800V DC power architectures for AI data centers. www.it-boltwise.de · www.eenewseurope.com
- [○ 1 SOURCE] The MVSST 2.0 is one of the first medium-voltage solid-state transformer platforms to achieve IEC certification. www.eenewseurope.com