Intel and Lens Technology sign MOU on advanced TGV glass packaging

Intel Corporation and Chinese manufacturer Lens Technology (蓝思科技) announced the signing of a memorandum of understanding (MOU) to jointly develop advanced packaging using Through‑Glass Via (TGV) technology. The collaboration will focus on key processes such as glass substrate via formation, high‑precision laser drilling, metallization of the vias, and multilayer interconnect routing. Intel will supply architectural reference information, design‑for‑manufacturability (DFM) guidelines, benchmark testing methods and validation approaches, while Lens Technology will leverage its experience in precision glass processing, pilot production lines and sample testing for potential customers.

Both parties also indicated plans to explore applications in AI PCs, data‑center servers, robotics, industrial intelligent equipment and edge‑computing hardware. Any engineering verification, certification or mass‑production activities will be governed by separate written agreements, aiming to establish a long‑term strategic partnership and accelerate the commercialization of next‑generation semiconductor packaging technologies.