Intel processes over one million wafers using High-NA EUV

Intel has reached a significant milestone in semiconductor manufacturing by processing over one million 300-mm wafers using High-NA EUV (Extreme Ultraviolet) technology. This figure includes wafers used for installation, research, process development, and production, rather than just finished processors.

The company began operating its first commercial High-NA system, the ASML TWINSCAN EXE:5000, in Oregon in early 2024. Intel currently utilizes two EXE:5000 systems and at least one faster EXE:5200B model. The transition of this technology from experimental stages to production-ready workflows is highlighted by this high volume of processed wafers.

High-NA EUV increases the numerical aperture from 0.33 to 0.55, allowing for finer structures in a single exposure. This capability can reduce or eliminate the need for complex multi-patterning, potentially simplifying manufacturing and lowering error rates. However, the technology involves high costs, with machines priced between $350 million and $400 million, and requires specialized materials and measurement systems.