J&TC to invest 347 billion KRW in Gimcheon TGV glass substrate plant

J&TC, a precision glass processing company, has signed a memorandum of understanding (MOU) with Gyeongsangbuk-do and Gimcheon City to establish a production plant for Through Glass Via (TGV) glass substrates in the Gimcheon 1 General Industrial Complex.

Between 2027 and 2030, the company plans to invest approximately 347 billion KRW to build the facility. The project is expected to create roughly 430 new jobs. TGV glass substrates are considered a next-generation core material for semiconductor packaging, utilizing micro-vias to enhance data processing and computing power for AI and high-performance computing (HPC) markets.

J&TC, founded in 1996, intends to leverage its expertise in 3D cover glass and laser precision processing to expand from mobile and automotive sectors into the AI and semiconductor materials industry. Local authorities stated they will provide administrative and financial support to ensure the investment facilitates the transition of the regional economy toward advanced high-tech industries.