Langdao Silex unveils prototype EUV light source for semiconductor manufacturing

Chinese startup Langdao Silex has unveiled its first self-developed Extreme Ultraviolet (EUV) lithography laser light source system, the FlintNano LPP-OXXO. This development represents a significant step toward establishing a domestic semiconductor supply chain amid ongoing export restrictions from the United States and the Netherlands.

The system utilizes Laser-Produced Plasma (LPP) technology, similar to the methods used by industry leader ASML. According to technical specifications, approximately 90% of the system's components are sourced from domestic Chinese suppliers. The prototype features a 1,000W driving laser with a repetition frequency between 1 and 20 kHz and a light conversion efficiency exceeding 2%. It has demonstrated stability for over 100 hours of continuous operation.

While the prototype is currently being used for wafer exposure testing, experts note that developing a light source is only one component of a complete EUV lithography machine. A fully functional system requires highly precise reflective optics, complex wafer positioning mechanisms, and the integration of thousands of high-precision subsystems. Langdao Silex estimates that it will take between three to five years of research and refinement to reach commercial mass-production standards.