LG Electronics joins NVIDIA Partner Network for AI datacenter cooling

LG Electronics has joined the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner. The partnership focuses on thermal management for high-density AI datacenters through liquid cooling technologies.

LG’s 2.6MW Coolant Distribution Unit (CDU) has qualified as NVIDIA DSX Ready, offering the largest cooling capacity among current DSX Ready CDU partners. The company has also completed infrastructure qualification for its 600kW and 1MW CDU models. These units utilize a direct-to-chip (DTC) liquid cooling approach to deliver coolant directly to CPUs, GPUs, and other heat-generating components, designed to function alongside existing air-cooling infrastructure in hybrid systems.

LG intends to showcase these qualified CDUs at Data Centre World Asia 2026 in Singapore and plans to seek NVIDIA qualification for a 4.0MW CDU model by the end of the year.