Linux Kernel 7.3 released with I/O improvements and hardware support

Linus Torvalds has released Linux Kernel 7.3, introducing significant improvements to I/O throughput and hardware compatibility. Key updates focus on the storage and block layers, including optimizations for Btrfs, ext4, F2FS, and FUSE. Specifically, ext4 now allows parallel execution of direct I/O writes under certain conditions, while FUSE has gained io_uring buffer pooling and zero-copy processing.

The release introduces FailFS, a new virtual file system designed for kernel-internal use, such as sandboxing, which rejects file operations with errors. Additionally, the NTFS driver now supports reading Windows System Compression (WOF).

On the hardware front, the kernel provides preliminary groundwork for AMD Zen 6 and Intel's next-generation processors, along with initial support for Apple M3 Pro, M3 Max, and M3 Ultra SoCs. The update also includes critical firmware workarounds for Samsung 990 PRO and 990 EVO Plus SSDs to prevent thermal throttling and performance degradation. Other notable additions include support for Intel Xe3P/Nova Lake integrated GPUs and drivers for upcoming 2026 hardware like the Steam Controller.