Manz Asia and SUSS MicroTec partner on semiconductor inkjet technology

Manz Asia and SUSS MicroTec SE have announced a strategic collaboration to advance inkjet technology for semiconductor manufacturing and advanced packaging. The partnership aims to transition inkjet printing from the research and development stage into high-volume manufacturing (HVM).

The collaboration combines Manz Asia’s inkjet printing and manufacturing expertise with SUSS MicroTec’s semiconductor process capabilities. A primary focus of the partnership is Fan-Out Panel Level Packaging (FOPLP), where the ability to selectively deposit materials can reduce waste and simplify processes compared to traditional full-surface coating methods.

By utilizing a ‘Lab-to-Fab’ approach, the companies intend to optimize process conditions and equipment configurations to meet the demands of increasingly complex semiconductor structures and large-area panel processing. This move is expected to accelerate technology development and reduce time-to-market for next-generation packaging solutions.