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[TECHNOLOGY] · China, Taiwan · 7 sources

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MediaTek Announces Dimensity 9600 Trio of Chips for Vivo X500 Series Launch

MediaTek is reportedly developing three variants of its next‑generation Dimensity 9600 SoC: a standard Dimensity 9600s built on TSMC's 3 nm process and derived from the Dimensity 9500, and two premium models, Dimensity 9600 Pro and Dimensity 9600 Pro Max, both fabricated on TSMC's 2 nm node. The three‑chip strategy mirrors the multi‑tier line‑ups used by Qualcomm and Apple, and the Pro versions are expected to compete directly with Qualcomm's upcoming Snapdragon 8 Elite Gen 6.

The forthcoming Vivo X500 smartphone family – comprising the X500, X500 Pro and X500 Pro Max – has cleared network certification in China, confirming that the devices are on track for an official unveiling in September 2026. According to leak reports, the X500 line will be powered by the MediaTek Dimensity 9600 Pro 2 nm chipset, paired with LPDDR6 memory, UFS 5.0 storage, and a Sony LYTIA L910 primary camera sensor, running OriginOS 7 on Android.

Both the new Dimensity lineup and the Vivo X500 series are positioned to challenge flagship offerings from competitors, marking a significant step for MediaTek in the high‑end mobile market.

Entities

Dimensity 9600 · MediaTek · Oppo · Qualcomm · TSMC · Vivo · X500 series

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