Micron targets 100,000 HBM wafers per month by 2026

Micron is reportedly planning to significantly expand its High Bandwidth Memory (HBM) production capacity. According to industry reports from South Korean sources, the company aims to reach approximately 100,000 wafers per month by the end of 2026. This would represent a near doubling of its previous capacity, which was estimated at 40,000 to 50,000 wafers per month last year.

While Micron has not officially confirmed these specific production targets, the company has announced the commencement of mass production for its 36 GB HBM4 12H memory, designed for platforms such as NVIDIA Vera Rubin. Micron also reported that its cumulative HBM4 revenue has already exceeded $1 billion. The company is currently providing customers with samples of 48 GB HBM4 16H memory.

Despite this expansion, Micron remains behind major competitors Samsung and SK hynix. Industry estimates suggest the South Korean manufacturers maintain capacities of approximately 150,000 to 200,000 HBM wafers per month. The increased production focus highlights the growing importance of HBM in the semiconductor market, particularly for AI applications.