Micron Technology launches $100 B New York chip fab as part of $250 B US investment plan

Micron Technology began construction of a $100 billion semiconductor campus in Clay, New York, pouring the first concrete and marking the largest private investment in the state’s history. The project, slated to include up to four fabs, aims to produce 40 % of the company’s DRAM in the United States and could generate as many as 50,000 jobs across construction and operations. Governor Kathy Hochul highlighted the campus as a cornerstone of a broader U.S. investment target that Micron has raised to more than $250 billion through 2035, with additional facilities planned for Boise, Idaho, where wafer output is expected by mid‑2027.

In parallel, Micron disclosed a strategic customer agreement with Ford and other long‑term deals that together represent $22 billion in deposits and are projected to drive over $100 billion in revenue. The company also announced a $3 billion U.S. supply‑chain investment, including a $500 million financing commitment to GlobalWafers to secure silicon wafer capacity for its fabs. These initiatives are presented as strengthening the domestic semiconductor supply chain and expanding AI‑driven memory production.