MicroVision introduces photonics technology for AI data centers

MicroVision, Inc. has announced the introduction of an advanced photonics solution through its subsidiary, Scantinel. The new technology is designed to address energy efficiency and performance challenges in next-generation AI data center scale-up architectures and intelligent infrastructure applications.

The solution features an External Laser Small Form-Factor Pluggable (ELSFP) module. This module provides a centralized, serviceable light source for Co-Packaged Optics (CPO) systems used in existing and future AI and cloud computing environments. The ELSFP technology is built upon a core Photonic Integrated Circuit (PIC), a two-dimensional platform intended to improve the speed, power efficiency, and economics of high-speed optical connectivity.

Glen DeVos, CEO of MicroVision, noted that the PIC technology at the heart of the module is the same core technology used in the company’s FMCW Lidar architecture. The development follows the acquisition of Scantinel and represents an expansion of the company’s technology into new markets.