Midea unveils hyperconverged cooling for AI data centers

Midea Building Technologies (MBT) presented its next-generation power-cooling hyperconvergence architecture and full-stack AI Data Center (AIDC) cooling solutions at Data Center World Asia 2026 in Singapore.

The showcased architecture integrates power systems, energy storage, magnetic bearing cooling sources, and liquid cooling CDUs into a unified infrastructure stack. This system-level approach aims to connect power supply, energy storage, and cooling distribution from the early stages of data center construction to better manage rising rack power densities.

In addition to the hardware solutions, MBT released a technical white paper detailing technology pathways for AI data center planning, construction, and operation. The solutions are designed to address high-density computing, tropical climates, and low-carbon operations by reducing reliance on mechanical cooling and improving Power Usage Effectiveness (PUE).