Mitsubishi Electric unveils NVIDIA-compatible AI data center design

Mitsubishi Electric Power Products, Inc., a US-based subsidiary of Mitsubishi Electric, has unveiled the ‘Chip-to-Grid DSX reference design’ intended for next-generation AI data centers. This design is compatible with NVIDIA Corporation’s Vera Rubin NVL72 rack-scale AI supercomputer and next-generation GPUs.

The solution provides an integrated framework that optimizes everything from grid connection to power delivery at the chip level, including power transmission, reception, storage, and cooling. To ensure stability and scalability for future gigawatt-class data centers, the design incorporates on-site power generation and Battery Energy Storage Systems (BESS). These systems allow the facility to operate as a microgrid during utility grid failures, ensuring continuous operation.

To manage high-density AI workloads, the design utilizes a dual-loop cooling architecture that combines direct liquid cooling for chips with air cooling for other components. The power system also supports 800VDC distribution alongside 415/480VAC. Mitsubishi Electric aims to provide these solutions to data center operators to address growing challenges in power efficiency, thermal management, and reliable operation driven by the expansion of generative, agent, and physical AI.