Nanya Technology selects Pingtung for new advanced packaging plant

Nanya Technology has selected the Pingtung Science Park for its new manufacturing facility, pivoting from a previous plan to establish a site in Yunlin. General Manager Li Pei-ying stated the decision was driven by the need to meet urgent customer demand and ensure the fastest possible deployment of DRAM capacity, explicitly denying any political motivations.

Unlike the company’s traditional wafer manufacturing sites, the Pingtung plant will focus on advanced back-end processes, including 3D IC, Through-Silicon Via (TSV), and wafer-to-wafer bonding. This strategic shift aims to capitalize on the rapid growth of AI applications by providing high-bandwidth and customized DRAM solutions.

The company will maintain a split operational model, keeping core research and development in northern Taiwan while utilizing the Pingtung site for large-scale manufacturing. Equipment installation is expected to begin in the second half of 2028, with a target monthly capacity of 30,000 wafers by that year, eventually scaling to 50,000 wafers by 2030. The project will be funded entirely through the company’s own cash reserves.