NearLink 3.0 standard released with AI and millimeter wave capabilities

The International NearLink Alliance held the CEIC 2026 summit in Shenzhen, announcing the official release of the NearLink 3.0 standard. This update focuses on intelligent IoT across various scenarios, introducing innovations in AI, passive technology, and millimeter wave applications.

Alongside the 3.0 standard, 15 recommended national standards were released, which are scheduled to take effect on April 1, 2027. The release included the ‘NearLink Short-range and Embodied Intelligence Technology Requirements Blue Paper.’

In related developments, Beijing-based Zhongke Jingshang Technology is reportedly investing in NearLink 2.0 chip research. The high-bandwidth SLB 2.0 chip is expected to enter commercial use by late 2026, which may accelerate the adoption of NearLink access points and routers.