Neways and Melexis partner on advanced MEMS pressure sensor packaging

Neways and Melexis have entered into a multi-year partnership to develop advanced packaging for Melexis’ Triphibian pressure sensor family. These MEMS (Micro-Electro-Mechanical Systems) devices are designed to measure pressure in both gaseous and liquid media.

The collaboration focuses on creating a compact housing that protects the sensor chip while ensuring accurate pressure transmission. This technology is specifically intended for thermal management applications in electric vehicles and liquid-cooled AI data centers, where sensors must operate reliably within coolants and other demanding environments.

Neways, a Dutch electronics manufacturer, will handle the advanced packaging, a strategic priority for the company. Melexis, a Belgian semiconductor manufacturer, noted that Neways was selected for its ability to provide deep packaging expertise early in the design process.