Nordson to debut SonoFlex acoustic microscopy at SEMICON West 2026

Nordson Test & Inspection will debut the SonoFlex Acoustic Microscopy Inspection (AMI) System at SEMICON West 2026, held from October 13–15 at the Moscone Center in San Francisco. The new platform is designed for non-destructive inspection of advanced semiconductor devices and packaging during back-end manufacturing.

The SonoFlex system utilizes ThruScan imaging technology, AI-powered analytics via the Nordson Intelligence™ Ecosystem, and FlexCore software to identify defects and isolate void counts. According to manufacturer specifications, the system features advanced pulser and transducer technologies that allow scanning speeds up to twice as fast as conventional solutions, with movement speeds reaching up to 1.8 m/s.

In addition to the SonoFlex, Nordson will showcase a broader portfolio of optical, X-ray, and acoustic metrology solutions intended to improve yield and productivity across front-end, mid-end, and back-end semiconductor production stages.