Northrop Grumman wins $7M DARPA contract for diamond-cooled microchips

Northrop Grumman has secured a $7 million contract from DARPA to advance the development of diamond-cooled microchips. This project represents Phase 2 of the Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program.

The initiative aims to integrate diamond directly into semiconductor devices to manage heat in high-power radio-frequency (RF) circuits. Because diamond conducts heat approximately five times faster than copper, it can effectively pull heat away from microscopic hotspots. This capability allows chips to operate at higher power densities without the risk of overheating, which currently limits the performance and lifespan of modern military electronics.

By utilizing diamond-based heat dissipation, engineers aim to create smaller, lighter, and faster equipment for military radar, satellite links, and communications. Following Phase 1, which saw a three-fold increase in power, Phase 2 seeks to push power density even further, potentially increasing it tenfold.