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[TECHNOLOGY] · United States, South Korea, Taiwan, China · 10 sources

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NVIDIA CEO predicts no memory oversupply before 2029

NVIDIA CEO Jensen Huang has dismissed market concerns regarding a potential memory semiconductor oversupply, stating that demand for high-bandwidth memory (HBM) and low-power DDR (LPDDR) will continue to expand for several years. Speaking at the GTC Berlin event, Huang emphasized that as AI industry growth continues, the increasing capacity and utility of memory will sustain demand through at least 2029.

In the broader semiconductor landscape, major players are racing to develop next-generation AI memory architectures. SK Hynix and Samsung Electronics are focusing on technologies like 3D DRAM and advanced HBM structures to improve power efficiency and data processing speeds. Meanwhile, Micron Technology has outlined a roadmap to expand production of its 1δ DRAM and G11 NAND processes by the second half of 2027, while also developing vertical HBM (vHBM) aimed for 2028 mass production.

Huang also addressed the growth of 'neocloud' companies, noting that the primary constraint for these AI data center providers is working capital rather than a lack of demand. Additionally, he expressed an open stance toward collaborating with Chinese memory firms, such as CXMT, noting that global supply chains often involve Chinese enterprises at various stages.

Entities

ChangXin Memory Technologies · CoreWeave · Jensen Huang · Micron Technology · Nebius · Nvidia · SK Hynix · Samsung Electronics

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